Overview

• Developed a facility which uses a pneumatic press and heated tip to attach microchips to PCB boards.

• The system also includes:

• Camera alignment system.

• Precision XY adjustment to position the chip.

• Bespoke vacuum chuck.

• Computer software to aid with chip alignment.

Method

• Iterative prototyping process using 3D printing.

• Weekly presentations to senior engineers with cost-benefit analyses.

• Custom parts CNC machined using precise tolerances.

• Frequent correspondence with manufacturers.

• Use of mills, lathes, drills etc.

• Developed GUI using Python.

Result

• Completed at 30% under the €10,000 budget.

• Bond strength increased 400% on average from un-pressurised sintering.

• Achieved chip positioning with micron accuracy.